ISSN : 1226-0517(Print)
ISSN : 2288-9604(Online)
ISSN : 2288-9604(Online)
Journal of Korean Society for Imaging Science and Technology Vol.28 No.4 pp.53-59
DOI : http://dx.doi.org/10.14226/KSIST.2022.28.04.2
DOI : http://dx.doi.org/10.14226/KSIST.2022.28.04.2
Conductivity Evaluation Before and After Photo-sintering of Non-solvent Type UV-curable Nano Silver Paste
Abstract
In this study, a nano silver paste capable of UV curing was developed without using any solvent. The viscosity and viscoelasticity of nano silver paste developed as a solvent-free type were measured. And after printing the pattern by screen printing, an electrode coating was formed by UV curing. Conductivity, pencil hardness, and adhesive strength of the formed electrode coating film were evaluated. In addition, the conductivity was evaluated by light sintering the electrode coating film. Finally, the curing characteristics of the electrode coating were evaluated by TGA and FT-IR. Summarizing these results, when only UV curing was performed, Paste(3) was the most excellent in terms of conductivity, adhesive strength, and curing characteristics. However, after photosintering, Paste(1) obtained the best conductivity. I think the reason for this is that the 10nm silver powder had the best sintering properties.